GJ CNC automatic measuring eqiupment
◎Equipment overview
This equipment is a fully automaticRobotbased on non-contact optics, and uses optical measurement to measure the relevantXYZdimensions that need to be controlled in the semiconductor process.X、Y control platform andZ-axis image autofocus, CCD Aligner-and-Robot Load on Loadto overcome the-Wafer -deformation and warping,and-SECSwill greatly improve the measurement efficiency.
◎Measurement object
Object：Si Wafer , thinning-Wafer
◎Equipment setting environment
The equipment installation place is a clean room(Class 100).
Temperature：22 ± 3℃ Temperature change：maximum to1.1℃/min
Humidity：No condensation. (Recommended Environment: Relative Humidity:50％）
Vibration//Acceleration: There is no vibration and shock when the equipment is in operation (recommended-environment
：0.05G-or less、Amplitude：5μ m-or less)
Floor flatness：<20mm/equipment setting area
Floor withstand load:>1000kg/mi
◎Equipment Specifications* Layout
